File:Prinzipieller Aufbau eines LED Moduls.jpg

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Deutsch: Weg der Wärme: Die Wärme entsteht im Chip und muss über das Substrat und die Leiterplatte abgeleitet werden. Mit der SCB-Technik lässt sich das Substrat so gestalten, dass es möglich ist, die Wärme schneller in die Leiterplatte abzuführen.
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Source W. C. Heraeus GmbH
Author W. C. Heraeus GmbH
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current14:56, 12 April 2010Thumbnail for version as of 14:56, 12 April 20101,245 × 706 (384 KB)TechnikInWorten (talk | contribs){{Information |Description={{de|1=Weg der Wärme: Die Wärme entsteht im Chip und muss über das Substrat und die Leiterplatte abgeleitet werden. Mit der SCB-Technik lässt sich das Substrat so gestalten, dass es möglich ist, die Wärme schneller in die

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