File:QP 2.jpg
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Size of this preview: 800 × 596 pixels. Other resolutions: 320 × 238 pixels | 640 × 477 pixels | 1,024 × 763 pixels | 1,215 × 905 pixels.
Original file (1,215 × 905 pixels, file size: 97 KB, MIME type: image/jpeg)
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Summary[edit]
| Description |
English: This is a picture of copper interconnects undercut by the deep reactive ion etch of silicon. |
| Date | Created July 2008 |
| Source | I created this image on one of the university's electron microscopes. |
| Author | Dave Kopp |
Licensing[edit]
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I, the copyright holder of this work, release this work into the public domain. This applies worldwide. In some countries this may not be legally possible; if so: I grant anyone the right to use this work for any purpose, without any conditions, unless such conditions are required by law. |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 00:08, 17 September 2008 | | 1,215 × 905 (97 KB) | Kopp.dave (talk | contribs) | {{Information |Description={{en|1=This is a picture of copper interconnects undercut by the deep reactive ion etch of silicon.}} |Source=I created this image on one of the university's electron microscopes. |Author=Dave Kopp |Date=Created July 2008 |Permi |
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