Template:Motd/2013-07-04 (en)

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Demonstration of ultrasonic wedge bonding of an aluminium wire between gold electrodes on a PCB board and gold electrodes on a sapphire substrate, reverse bonding order, at the NanoFabLab at AlbaNova University Center/Stockholm University.

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Motd/2013-07-04 (en) Motd/2013-07-04 (zh-hans)