File:Wafer die's yield model (10-20-40mm) - Version 2 - DE.png

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English: 3 models for die's yield on a 300mm wafer. Those are different only die size.
1(Top):10mmx10mm 2(Middle):20mmx20mm 3(Bottom):40mmx40mm
Each yields are 94.2%/75.7%/35.7% by using same damaged spots(red dot). Smaller die size can minimize the bad dies impact which shown by yellow. If process scale could shrink from 40mm to 10mm, the linear size ratio and area ratio would be 4:1 and 16:1, but Good die count will be 10:620 on those models.
Deutsch: Drei Beispiele für die Änderung der Ausbeute auf einem 300-mm-Wafer in Abhängigkeit von der Die-Größe (oben: 10 mm × 10 mm; mitte: 20 mm × 20 mm; unten: 40 mm × 40 mm). Bei gleicher Defektanzahl (roter Punkt) verringert sich die Anzahl der defekten Chips (gelb) und es ergeben sich Ausbeuten von 94,2 %, 75,7 % bzw. 35,7 %.
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This is a retouched picture, which means that it has been digitally altered from its original version. Modifications: translation, new arrangement. The original can be viewed here: Wafer die's yield model (10-20-40mm).PNG: . Modifications made by Cepheiden.

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  • File:Wafer_die's_yield_model_(10-20-40mm).PNG licensed with Cc-by-sa-3.0,2.5,2.0,1.0, GFDL
    • 2011-04-18T10:06:07Z Shigeru23 1000x2500 (224008 Bytes) {{Information |Description ={{en|1=3 models for die's yield on a 300mm wafer. Those are different only die size.1(Top):10mmx10mm 2(Middle):20mmx20mm 3(Bottom):40mmx40mmEach yields are 94.2%/75.7%/35.7% by using same damage

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current11:53, 27 December 2011Thumbnail for version as of 11:53, 27 December 20113,000 × 1,000 (164 KB)Cepheiden (talk | contribs)== {{int:filedesc}} == {{Information |Description={{en|1=3 models for die's yield on a 300mm wafer. Those are different only die size.<br />1(Top):10mmx10mm 2(Middle):20mmx20mm 3(Bottom):40mmx40mm<br />Each yields are 94.2%/75.7%/35.7% by using same damag

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