File:Etched-boundary-of-Ti-substrate100SnSi-solder.jpg

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Etched-boundary-of-Ti-substrate100SnSi-solder.jpg (600 × 467 pixels, file size: 172 KB, MIME type: image/jpeg)

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English: Etched boundary of Ti substrate/100Sn/Si solder.
Date
Source Roman Koleňák et. al. "Research of Joining Brittle Nonmetallic Materials with an Active Solder", Advances in Materials Science and Engineering doi:10.1155/2014/729135
Author Roman Koleňák, Michal Prach
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https://creativecommons.org/licenses/by/4.0/ This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

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Date/TimeThumbnailDimensionsUserComment
current09:14, 3 March 2020Thumbnail for version as of 09:14, 3 March 2020600 × 467 (172 KB)Sohmen (talk | contribs)Uploaded by the NOA Upload Tool

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