File:PlannedObsolescencePCB german.png
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Summary
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| Description |
English: Limiting the useful life of a printed ciruit board by not installing a planned heat sink, resulting in slow thermal degradation ("cold solder" joint) on the reverse side of the board.
Deutsch: Das Weglassen eines geplanten und vorgesehenen Kühlkörpers führte zur zeitlich langsamen thermischen Degradierung ("kalte Lötstellen") auf der Unterseite der Leiterplatte. |
| Date | |
| Source | Own work |
| Author | Linear77 |
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I, the copyright holder of this work, hereby publish it under the following license:
 
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This file is made available under the Creative Commons CC0 1.0 Universal Public Domain Dedication. |
| The person who associated a work with this deed has dedicated the work to the public domain by waiving all of their rights to the work worldwide under copyright law, including all related and neighboring rights, to the extent allowed by law. You can copy, modify, distribute and perform the work, even for commercial purposes, all without asking permission.
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 13:03, 15 December 2014 | | 1,328 × 927 (1.36 MB) | Linear77 (talk | contribs) | Limiting the useful life of a PCB by not installing a planned heat sink, resulting in slow thermal degradation ("cold solder" joint) on the reverse side of the PCB. Das Weglassen eines geplanten und vorgesehenen Kühlkörpers führte zur zeitlich langs... |
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