File:Stealth diced Si wafer 150µm 430x400 MB11.png
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| Description |
English: Cross sectional micrograph of cleavage plane after stealth dicing a Si wafer of 150 µm thickness, compare M. Birkholz, K.-E. Ehwald, M. Kaynak, T. Semperowitsch, B. Holz, S. Nordhoff (2010). "Separation of extremely miniaturized medical sensors by IR laser dicing". J. Opto. Adv. Mat. 12: 479-483. |
| Date | |
| Source | Own work |
| Author | MBirkholz |
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I, the copyright holder of this work, hereby publish it under the following license:
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 06:31, 17 February 2011 | | 430 × 400 (294 KB) | MBirkholz (talk | contribs) | {{Information |Description ={{en|1=Cross sectional micrograph of cleavage plane after stealth dicing a Si wafer of 150 µm thickness, compare {{cite journal | author = M. Birkholz, K.-E. Ehwald, M. Kaynak, T. Semperowitsch, B. Holz, S. Nordhoff | title |
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