File:Stealth diced Si wafer 150μm 430x400 MB11.png

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Stealth_diced_Si_wafer_150μm_430x400_MB11.png (430 × 400 pixels, file size: 294 KB, MIME type: image/png)

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English: Cross sectional micrograph of cleavage plane after stealth dicing a Si wafer of 150 µm thickness, compare M. Birkholz, K.-E. Ehwald, M. Kaynak, T. Semperowitsch, B. Holz, S. Nordhoff (2010). "Separation of extremely miniaturized medical sensors by IR laser dicing". J. Opto. Adv. Mat. 12: 479-483.
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Author MBirkholz

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current06:31, 17 February 2011Thumbnail for version as of 06:31, 17 February 2011430 × 400 (294 KB)MBirkholz (talk | contribs){{Information |Description ={{en|1=Cross sectional micrograph of cleavage plane after stealth dicing a Si wafer of 150 µm thickness, compare {{cite journal | author = M. Birkholz, K.-E. Ehwald, M. Kaynak, T. Semperowitsch, B. Holz, S. Nordhoff | title

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