File:Stealth diced Si wafer 150μm 430x400 MB11.png
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Stealth_diced_Si_wafer_150μm_430x400_MB11.png (430 × 400 pixels, file size: 294 KB, MIME type: image/png)
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[edit]DescriptionStealth diced Si wafer 150μm 430x400 MB11.png |
English: Cross sectional micrograph of cleavage plane after stealth dicing a Si wafer of 150 µm thickness, compare M. Birkholz, K.-E. Ehwald, M. Kaynak, T. Semperowitsch, B. Holz, S. Nordhoff (2010). "Separation of extremely miniaturized medical sensors by IR laser dicing". J. Opto. Adv. Mat. 12: 479-483. |
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Source | Own work |
Author | MBirkholz |
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current | 06:31, 17 February 2011 | 430 × 400 (294 KB) | MBirkholz (talk | contribs) | {{Information |Description ={{en|1=Cross sectional micrograph of cleavage plane after stealth dicing a Si wafer of 150 µm thickness, compare {{cite journal | author = M. Birkholz, K.-E. Ehwald, M. Kaynak, T. Semperowitsch, B. Holz, S. Nordhoff | title |
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