Dual inline packages

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English: In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be through-hole mounted to a printed circuit board (PCB).

Drawings of DIP[edit]

8 Pins[edit]

14 Pins[edit]

16 Pins[edit]

Photos of DIPs alone[edit]

Photos of DIPs in situ[edit]