File:Semiconductor fabrication with and without CMP RU.svg
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Summary[edit]
| Description |
English: Comparison between semiconductor circuits manufactured with and without chemical-mechanical polishing (cross section
Русский: Сравнение срезов ru:СБИС, изготовленных без использования CMP (Химико-механической планаризации) - слева, и с использованием CMP после каждого слоя - справа.
Deutsch: Vergleich zwischen Halbleiterschaltkreisen hergestellt mit und ohne chemisch-mechanisches Polieren (Querschnitt)
Español: Comparación de Semiconductores fabricados sin y con Pulimiento Químico-Mecánico |
| Date | |
| Source | translate of File:Semiconductor_fabrication_with_and_without_CMP_DE.svg |
| Author | A5b |
| Other versions |
File:Semiconductor_fabrication_with_and_without_CMP_DE.svg, File:Fabricación de Semiconductores con y sin PQM (CMP).svg |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 03:29, 20 November 2010 | | 1,024 × 568 (31 KB) | A5b (talk | contribs) | {{Information |Description={{en|1=Comparison between semiconductor circuits manufactured with and without chemical-mechanical polishing (cross section}} {{ru|1=Сравнение срезов ru:СБИС, изготовленных без испол� |
| 03:27, 20 November 2010 |  | 1,024 × 568 (31 KB) | A5b (talk | contribs) | {{Information |Description={{en|1=Comparison between semiconductor circuits manufactured with and without chemical-mechanical polishing (cross section}} {{ru|1=Сравнение срезов ru:СБИС, изготовленных без испол� | |
| 03:19, 20 November 2010 |  | 1,024 × 568 (32 KB) | A5b (talk | contribs) | {{Information |Description={{en|1=Comparison between semiconductor circuits manufactured with and without chemical-mechanical polishing (cross section}} {{ru|1=Сравнение срезов ru:СБИС, изготовленных без испол� |
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