File:Trench doubling.svg

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Original file (SVG file, nominally 392 × 487 pixels, file size: 3 KB)

Captions

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Summary

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Description
English: The basic process for doubling trenches or holes.
  • Top: Photoresist is coated over the starting trench or hole pattern.
  • Center: Holes or trenches are exposed and etched into the underlying layer.
  • Bottom: Photoresist is removed, leaving the sum of the previous and new patterns.
Date
Source Based on the JPG drawing. SVG: Own work
Author

JPG Drawing: Guiding light at en.wikipedia

SVG drawing: Wdwd
Other versions
JPG drawing

Licensing

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I, the copyright holder of this work, hereby publish it under the following licenses:
GNU head Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A copy of the license is included in the section entitled GNU Free Documentation License.
w:en:Creative Commons
attribution
This file is licensed under the Creative Commons Attribution 3.0 Unported license.
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  • to remix – to adapt the work
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  • attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
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File history

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Date/TimeThumbnailDimensionsUserComment
current10:48, 26 November 2011Thumbnail for version as of 10:48, 26 November 2011392 × 487 (3 KB)Wdwd (talk | contribs)== {{int:filedesc}} == {{Information |Description={{en|The basic process for doubling trenches or holes. * Top: Photoresist is coated over the starting trench or hole pattern. * Center: Holes or trenches are exposed and etched into the underlying layer. *

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