Category:Packaging (microfabrication)
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final stage of semiconductor device fabrication | |||||
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Subcategories
This category has the following 2 subcategories, out of 2 total.
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- Tape-automated bonding (5 F)
- Thermosonic bonding (6 F)
Media in category "Packaging (microfabrication)"
The following 5 files are in this category, out of 5 total.
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3D Orthogonal Quilt Packaging.jpg 5,312 × 2,988; 1.98 MB
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3x3 Quilt Packaging Chip Array.jpg 652 × 508; 210 KB
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Concept Image of Quilt Packaging Nodules and RDL Metal.jpg 915 × 597; 399 KB
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Hemispherical Curved Multi-Chip Array using Quilt Packaging.jpg 2,116 × 1,411; 1.78 MB
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Quilt Packaging Nodules with Reflowed Solder.jpg 1,146 × 856; 736 KB