Category:Semiconductor devices fabrication

Thể loại con

Thể loại này có 21 thể loại con sau, trên tổng số 21 thể loại con.

Tập tin trong thể loại “Semiconductor devices fabrication”

67 tập tin sau nằm trong thể loại này, trong tổng số 67 tập tin.

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  14 nm half-pitch multipatterning.png 910×375; 23 kB
  
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  14 nm half-pitch multipatterning.svg 743×337; 49 kB
  
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  4-fach-NAND-C10.JPG 967×1.206; 1,6 MB
  
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  7 nm litho options.png 859×582; 410 kB
  
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  Alu bridge.jpg 1.020×694; 214 kB
  
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  Anti-spacer Double patterning.png 815×593; 16 kB
  
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  APD structure.svg 750×678; 27 kB
  
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  APD with Superlattice.svg 681×633; 8 kB
  
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  APD.png 400×290; 21 kB
  
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  Ballbond-trand.png 2.331×1.197; 148 kB
  
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  Bell telephone magazine (1922) (14569544079).jpg 2.064×1.684; 1,34 MB
  
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  Bivar-logo.png 213×60; 3 kB
  
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  Buried zener structure-en.svg 521×283; 5 kB
  
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  Buried zener structure.svg 521×283; 16 kB
  
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  Buried zener vs npn epi.svg 521×616; 26 kB
  
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  Centrotherm diffusion furnace at LAAS 0489.jpg 2.592×3.872; 3,85 MB
  
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  Centrotherm diffusion furnace at LAAS 0491.jpg 2.592×3.872; 3,78 MB
  
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  Centrotherm diffusion furnace at LAAS 0493.jpg 2.592×3.872; 4 MB
  
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  Centrotherm diffusion furnaces at LAAS 0481.jpg 2.592×3.872; 4,22 MB
  
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  Comparison semiconductor process nodes.svg 990×765; 72 kB
  
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  Dicing blade.jpg 578×443; 87 kB
  
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  Diferencia estructura.PNG 552×240; 41 kB
  
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  DRAM burried capacitor configuration.svg 800×600; 4 kB
  
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  DRAM self-aligned storage node locations.png 706×550; 52 kB
  
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  DRAM trench configuration 2.svg 512×512; 4 kB
  
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  DRAM trench structure configuration1 1.svg 512×512; 6 kB
  
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  DRAM trench structure configuration1.svg 800×600; 6 kB
  
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  Field-induced MRAM schematic ja.png 5.464×4.672; 132 kB
  
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  Framework for big data and analytics for semiconductors manufacturing.jpg 930×474; 127 kB
  
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  GeS CVD setup.png 1.254×607; 89 kB
  
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  GST CVD setup.png 467×233; 55 kB
  
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  GST CVD setup.tif 1.074×538; 220 kB
  
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  Illustration of C-V measurement.gif 322×308; 93 kB
  
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  KO fig21 applications Corelv11.png 1.748×1.799; 483 kB
  
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  Laser diode with case cut away.jpg 512×437; 118 kB
  
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  LELE challenge.png 472×353; 5 kB
  
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  Lift-off (microtechnology) process.svg 512×664; 31 kB
  
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  Lift-off-Verfahren (Fehlerbilder).svg 1.100×600; 44 kB
  
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  Lift-off-Verfahren (Halbleitertechnik).svg 1.024×756; 41 kB
  
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  Line cut location offset.png 417×442; 6 kB
  
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  Main applications of ALD.png 1.692×1.718; 317 kB
  
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  Microprocessore silicio germano.jpg 250×324; 21 kB
  
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  Molecular Beam Epitaxy.png 1.400×739; 153 kB
  
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  Moore Kosten.png 943×665; 36 kB
  
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  OR2 layout.PNG 678×348; 19 kB
  
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  Organic transistor Greek.png 415×211; 95 kB
  
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  Overflow.svg 1.000×800; 24 kB
  
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  Overlay - typical model terms DE.svg 617×591; 16 kB
  
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  Piranha solution.png 864×1.536; 1,55 MB
  
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  SADP challenge.png 504×497; 8 kB
  
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  SADP then SATP.png 668×253; 8 kB
  
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  Salle blanche ensim.jpg 4.256×2.832; 5,61 MB
  
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  Schottky-Transistor-Side.svg 364×204; 22 kB
  
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  SE Making Ingot Step 02.svg 346×371; 11 kB
  
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  SE Making Ingot Step 03.svg 317×329; 12 kB
  
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  SE Making Ingot Step 04 ver01.svg 310×376; 16 kB
  
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  Self-aligned silicidation.svg 1.990×692; 52 kB
  
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  SemiconductorProcessSize.png 1.440×852; 48 kB
  
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  Siliconchip by shapeshifter.png 1.276×891; 1,83 MB
  
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  Spacer formation (DE).svg 875×361; 14 kB
  
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  Spacer Patterning.JPG 393×576; 19 kB
  
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  Spacer trimming.png 1.157×484; 17 kB
  
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  The entrance of 3S Silicon Tech., Inc.jpg 898×783; 386 kB
  
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  Trilogy WSI Wafer.png 1.920×1.920; 7,45 MB
  
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  Two-bar challenge.png 601×351; 8 kB
  
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  Wafermap showing fully and partially patterned dies.svg 657×657; 103 kB
  
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  Worldwide Semiconductor Sales in Billion US-Dollar GERMAN.jpg 621×327; 27 kB